Reflow device
Introducing wafer bump reflow, vacuum reflow equipment, and tabletop reflow equipment.
We would like to introduce the "Reflow Equipment" handled by Dai Nichi Shoji Co., Ltd. The "N2 Compact Size Reflow" is a product that achieves a compact size with a total length of 2.5m and 6 zones, suitable for packages such as BGA/CSP. The "φ6-8 Inch Wafer BUMP Reflow" can be used as a wet back device for bump formation after solder plating, while the "φ8-12 Inch Wafer BUMP Reflow" is suitable for reflow after ball mounting and bump printing. Additionally, we also handle "Vacuum Reflow Equipment" and "Tabletop Reflow Equipment." [N2 Compact Size Reflow Features] ■ Max 350℃ (±2.5℃) ■ Compatible Size: Max 250×230mm ■ Oxygen Concentration in Furnace: 50ppm and above ■ 3-phase 200V 20kW ■ Combination of hot air circulation and far infrared is possible *For more details, please refer to the PDF materials or feel free to contact us.
- Company：大日商事
- Price：Other
